HF SuperPacker Pro 100W Amp Module Layout Detail 9/6/2011

 

 

I appreciate it very much that you have taken the time to stop by and learn more about the new amp design.

You are seeing the internal detail showing how the circuit board, thermal block, heat sink and skin are connected to each other. The heat sink is attached to the skin. The thermal block is attached to the heat sink through a skin cutout. The circuit board is attached to the thermal block. The MOSFETs are attached to the thermal block with circuit board cut outs in the circuit board to allow the MOSFETs to be mounted to the thermal block. The tabs of the MOSFETs solder to the top side of the circuit board.

The thermal block drawing was modified to add built in spacing to hold the MOSFETs at the proper distance. The thermal block mounts flush with the bottom of the circuit board. The surfaces are milled flat with spacing needed for MOSFET flush mounting. You can zoom the attached file for more detail.

I decided to add 1.25 inch to the left side of the circuit board to make the whole assembly symmetrical. I am going to add to the artwork for the binary tree pi network circuits for input range adjustment. 

I envision the amp to have a height of 3.5 inch which will be sufficient room for the optional touch screen display on the front. Along the back and sides will be heat sinks for the optional RF modules.

There is a lot to think about and consider. I want to get this major module into prototype hardware as soon as funds will allow. I would appreciate your financial help in the R&D process: R&D Support

Sign up for the project. Send email to vstamps@comcast.net with your call sign and shipping address. No obligation until call for payment.

Amp module layout hfspprov3

File Attachment: amp mounting detail hfspprov3.pdf (14 KB)

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