Case Concept Layout

The HF SuperPacker Pro V3 is shown in a concept layout drawing: File Attachment: Case Concept Layout HF SPPRO V3.pdf (14 KB) Use your zoom capability to view various parts in greater detail. It is only a first pass 2–D drawing but hopefully you can get the ideas I present. The size is projected to be 8x4x7 inch (LWH).

We defined and created the individual modules and now we can package these building blocks into a functioning amp. The LCDs form factor governed one important aspect. The amp stands with a small footprint.

The LCD Touch Screen (the glass) is flush mounted through the front panel with a BEZEL to protect and finish the edges. We are using the glass module supplied by Microchip an use it on a QVGA display module of our design. It is great to piggy back ride the volume that Microchip has for this product. Otherwise, there is 4,500 piece minimum if you go direct to the manufacturer. The QVGA display module is attached by spacers to the backside of the QVGA Control Module as a sandwich. The whole assembly is held captive to the backside of the front panel by 4 PEM studs/spacers.

There is a mid-position isolation wall and shelf that separates the computer from the amplifier and RF. Within the computer chamber is mounted the MPU module. Some easy access method will have to be devised to allow removal of the computer modules without partial disassembly of the amp case. The QVGA Display, Controller and MPU Module are all high-density surface mount. These items will be assembled and tested when you receive them. Case construction is painted steel.

On the RF side, sitting on the shelf is the low-pass filter module. The shelf is about mid-position and the power supply unit is to be mounted on the opposite side.

The Amplifier Module is mounted in the rear half of the case. It is attached by a thermal transfer block to the side panel heat sink shown in the left side view (not identified but above the amp shown in red hidden lines). The left side will consist of at least two detachable panels to permit access to the modules. The right side may only need one panel.

The Rear Panel shows the RF PATH module mounted on the inside of the panel. The two transceiver inputs and two antenna outputs are shown in their approximate location. Connections from the RF PATH module to the amp and MPU use the SMA cables. Also shown are the power input related components.

The top view shows an almost full-length low-profile heat sink. The optional RF Modules attach here if ordered.

I am sure this has lots of detail to add. I would appreciate your comments, as I value your input to the project.

73 K5OOR –  Virgil



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